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rina Laser Application System 0 1,290 2018.09.17 09:59

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Laser Cutting System

Application package

PCB of CIPOSmini(30B & 29C)

Capability

60+5 sec/Tray(2PCB arrays)

Pick & place unit

Vacuum filter & vacuum

Pick & place unit

ection ionizer system

Cutting position accuracy

Under x/y ±100μm

Laser system

Wave length 1,064μm

Max power

150W

Cooling

Water cooling chiller

Max marking area

50ⅹ50mm(Unit)

This machine cuts a PCB plate into individual units using a laser.

Detailed information of Laser Cutting System

Laser Cutting System

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