SemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductorSemiconductor
Semiconductor
rina 0 2,032

Wire Bonding Handler

Main Power
220V, 3Phase, 50Hz, 30A
Main Air Pressure
5Kgf/㎠
Size(mm)
5,700(L) X 1,700(W) X 1,500(H)

This handler is to supply lead frame with multiple pockets and load DBC on each pocket of lead frame. Then, 3 sets of bonding heads conducts wire bonding. After wire bonding, lead frames are put into magazine. This handler is equipped with vision syste

 Detailed information of Wire Bonding Handler

Wire Bonding Handler

Facebook Twitter GooglePlus KakaoStory NaverBand
Banner
000.0000.0000
월-금 : 9:30 ~ 17:30, 토/일/공휴일 휴무
런치타임 : 12:30 ~ 13:30

Bank Info

국민은행 000000-00-000000
기업은행 000-000000-00-000
예금주 홍길동
Facebook Twitter GooglePlus KakaoStory NaverBand
    • Follow US :