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Semiconductor

Laser Deflash System(Ⅱ)
Dimension 4,380 X 1,400 X 1,560
Loading Stack magazine & slot magazine
Unloading Tray(Adjustable)
Controller PLC
Power AC220V, 3Ø, 50/60Hz
Laser Fiber laser 10W
MTBA > 1 Hour
MTBF > 200 Hours
This machine uses a laser to remove mold flashes on the package surface. The machine has a turnover function that enables it to deflash both the top and the bottom sides of the lead frame. Both stack and slot magazines can be used for loading, and a number of different sized trays can be used for unloading. Furthermore, the transfer rail can be adjusted for various lead frame sizes.
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