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Marking & Trim/Form System

Model : SSDIP 25L/38L

Press Type Cam press
Controller PLC
Display Panel Touch screen LCD
On / Loader 2 Magazine
Offloader Tube stack
Productivity More than 40 SPM
Laser EO Technics
Vision Marking & Lead Inspection
Dimension 2,400(W) x 2,200(D) x 1,600(H)mm
This is the equipment designed to cut the lead of semi-conductor device using die tool fabricated in a certain shape and remove mold impurities, or modify the lead into desired shape and mark logos, number etc by laser on the package surface.