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Semiconductor

Laser Cutting System
Application package PCB of CIPOSmini(30B & 29C)
Capability 60+5 sec/Tray(2PCB arrays)
Pick & place unit Vacuum filter & vacuum
Detection ionizer system
Cutting position accuracy Under x/y ±100μm
Laser system Wave length 1,064μm
Max power 150W
Cooling Water cooling chiller
Max marking area 50ⅹ50mm(Unit)
Cutting speed Within 20sec/PCB array
This machine cuts a PCB plate into individual units using a laser.
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