HOME  >  제품소개  >  Semiconductor


PCB Cutting & Connection System
Application Package CIPOS mini (30B & 29C)
Power AC220V, 3 Phase, 60Hz
Air 5~6Kg/㎠
System Control PC & PLC
Operation Mode 3 Type (Auto/Manual/Step)
Display 19” LCD Monitor 3 EA
Loading SLOT L/F Magazine & Stack PCB
Unloading SLOT L/F Magazine
Dimension 3,708(W) X 1,755(D) X 1,713(H)
Laser Laser System : CO2/150W/Nozzle, Type/Spot Size 150μm
This machine connects singulated PCB units to lead frames. PCB strips, stacked in a magazine, are transferred to a laser cutting station where they are singulated from a single PCB unit. The singulated units move to a cleaning and vision station. Then they are connected onto the lead frames and transferred into a SLOT L/F magazine. The entire process is fully automatic.