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Semiconductor

Die Coating System
UPH More than 6.5K
MTBF 1 Month
MTBA 1 Day
Machine dimension(mm) 1,160(W) x 770(D) x 1,756(H)
- Multimagazine stackable onloader & unloader(3~5 Magazine)
- Controlled by PLC
- Conversion time within 15 Minutes.
- Two spray valves having each controller
- Feeding by Servo motor & gripper

his machine coats the lead frame attached to the die after the wire bonding process. Spraying a coating on the die makes it easier to mold the die efficiently. Since the machine is universal, it can accommodate many different lead frame types.
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