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Semiconductor

Wire Bonding Handler
Main Power 220V, 3Phase, 50Hz, 30A
Main Air Pressure 5Kgf/㎠
Size(mm) 5,700(L) X 1,700(W) X 1,500(H)
This handler is to supply lead frame with multiple pockets and load DBC on each pocket of lead frame. Then, 3 sets of bonding heads conducts wire bonding. After wire bonding, lead frames are put into magazine. This handler is equipped with vision system to inspect lead frame orientation and wire bonding.
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