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Semiconductor
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Wire Bonding Handler

Main Power
220V, 3Phase, 50Hz, 30A
Main Air Pressure
5Kgf/㎠
Size(mm)
5,700(L) X 1,700(W) X 1,500(H)

This handler is to supply lead frame with multiple pockets and load DBC on each pocket of lead frame. Then, 3 sets of bonding heads conducts wire bonding. After wire bonding, lead frames are put into magazine. This handler is equipped with vision syste

 Detailed information of Wire Bonding Handler

Wire Bonding Handler

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